Areas
of Expertise
Robotics, Microrobotics and Control Systems, MEMS,
Micromanufacturing (Microsystems Assembly and
Packaging).
Background
Dan Popa received his B.A. and M.S. degrees in 1993
and 1994, respectively, from Dartmouth College. He
received his Ph.D. in Electrical Engineering at
Rensselaer Polytechnic Institute in 1998. Between
1998 and 2004, he was part of the technical staff at
the Center for Automation Technologies (CAT) at RPI
as a research scientist. In May 2002 Dr. Popa
received the Kayamori Best Paper Award at the IEEE
International Conference in Robotics and Automation
for work in automated microassembly. He joined UTA
in September 2004 with the Automation and Robotics
Research Institute and is currently an assistant
professor with the Electrical Engineering
Department. Dr. Popa continues his research focusing
on parallel microassembly, microrobotics, 3D wafer
level packaging, microfluidics packaging for
bio-sensor applications, hermetic sealing, and the
robotic deployment of sensor networks using
autonomous land robots. Dr. Popa is a member of
IEEE, ASME, and SME, and his publications span
across the areas of control systems, robotics and
MEMS.
